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Membrane Valve
(by Dr. Daniel C. S. Bien)
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The
membrane valve structure was fabricated using a combination
of bulk and surface micromachining techniques. The valve
comprises a silicon substrate with an etched aperture to
form the inlet for gas or liquid. A surface micromachined
polysilicon movable plate is located at the centre above the
inlet port. The plate is supported by four flexible
polysilicon arms anchored to the silicon substrate.
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The
valve operates in a passive mode with the applied pressure
controlling the position of the valve plate. During forward
pressure, fluid first passes through the inlet aperture on
the silicon substrate, pushes the valve plate open, then
flows through the narrow gap between the plate and the
substrate and finally through passages around the supporting
arms. When the pressure acts in the reverse direction, the
polysilicon plate is pushed against the substrate, forming a
seal and hence restricting the flow. A pressure drop across
the central plate is required to shut the valve. At zero
pressure difference, the valve plate will move to its
resting position, which is slightly open. |
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Fluid flow through membrane valve |
FIB cross-section |
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The
ZYGO surface profile scan shows that the polysilicon valve deflect upwards when released from
the substrate due to built-in compressive stress, of
approximately 113 MPa, in the film. An automated
measurement system was developed to determine flow rates
of liquid through the valve under forward and reverse
pressure. The flow rate of methanol was approximately 7
times greater than that of de-ionised water at a
pressure of 11 kPa due to its lower viscosity and
surface tension. The membrane valve operates
successfully with negligible reverse flow, the maximum
reverse flow rate being less than 3 % of the forward
flow. |
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ZYGO Scan |
Liquid Flow |
Gas Flow |
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References
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Bien
DCS, Mitchell SJN and Gamble HS,
“Fabrication and characterisation of a micromachined passive valve”,
Journal of Micromechanics and Microengineering, vol. 13,
pp557-562, Sept 2003.
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