Northern Ireland
Semiconductor Research Centre

 
Home Location Staff Publications Links
 

Introduction

 

Research Activities

Nanotechnology

System On Chip

Microelectromechanical Systems (MEMS)

Integrated Circuits and Electronic Devices

Silicon On Insulator (SOI)

Metallisation

Materials and Technology

Microelectronic Device Simulations

 

Research Opportunities

Research Contacts

Laboratory & Facilities

NISRC Members Only

 

Contact

Please address any queries regarding the group to :

Professor Harold Gamble

Microelectronics Group,

School of Electrical and Electronic Engineering, Queen's University Belfast, Ashby Building, Stranmillis Road, Belfast BT9 5AH, United Kingdom.

Tel.  : +44 (0)2890 975439

Fax. : +44 (0)2890 667023

Email : h.gamble@qub.ac.uk

 



Microelectromechanical Systems (MEMS) and Devices

During the past decade, considerable effort has been devoted to microelectromechanical systems (MEMS), more commonly known in Europe as microsystem technologies (MST). Silicon micromachining has become a fundamental tool that enables the fabrication of such devices. The technology has evolved from integrated circuit fabrication processes, namely film formation, doping, lithography and etching. In general, silicon micromachining can be subdivided into two categories, bulk and surface machining. In bulk micromachining, three dimensional features and micromechanical devices are realised out of single crystal silicon wafers. In contrast, surface micromachining employs thin-film layers on the substrate surface and generally involves dimensions smaller than those of bulk micromachined devices.

MEMS components have a wide range of applications including electrical, mechanical and fluidic systems. Some application areas for MEMS devices and systems are listed in Table 1.

Major Areas

Typical Devices / Applications

Automotive

Pressure sensors, Accelerometers, Injection nozzles

Medical and Biomedical

Hearing aids, Heart pacemakers, Drug Delivery, 

Lab on a chip (LOC), Blood pressure monitoring

Environmental Monitoring

Chemical sensors, Ion mobility spectrometer, 

Micro spectrophotometer, Electronic nose

Information Technology

Hard disk drive heads, Magnetic optical heads,

Ink jet print heads, Projection display.

Telecommunication

Optical switches, Attenuators, Gain equalisers, Microrelays, RF components.

Table 1.  Application areas for MEMS devices and systems.

 

In the automotive industry, there is always a need for more effective, accurate, reliable, and low-cost sensors. An example of silicon pressure sensor is the manifold absolute pressure sensor (MAP) used to control the air-fuel ratio in the engine management system. Accelerometers on the other hand, are widely used in crash detection and air bag release systems.

In the field of telecommunication, there is a large market for optical networking (MOEMS) and wireless communication (RF-MEMS) components. MEMS applications in this area promise to provide higher levels of integration at lower costs and reduced power consumption. Research in this area also contributes to the reduction of losses in transmission lines connecting radio frequency (RF) components and integrating active and passive elements on a RF package.

Other fields of MEMS applications are in the area of information technology (IT) peripherals, biomedical devices and environmental monitoring. Currently in the area of information technology, the MEMS market is dominated by two products, the hard disk drive heads and ink jet print heads. Microluidics and integration with electronic systems also produces rewarding application in areas such as drop delivery systems for medical/biomedical applications and in the field of environmental monitoring.