Semiconductor and Nanotechnology

NISRC

 
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Introduction

 

Research Activities

Nanotechnology

System On Chip

Microelectromechanical Systems (MEMS)

Integrated Circuits and Electronic Devices

Silicon On Insulator (SOI)

Metallisation

Materials and Technology

Microelectronic Device Simulations

 

Research Opportunities

Research Contacts

Laboratory & Facilities

NISRC Members Only

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Contact

Please address any queries regarding the group to :

Professor Harold Gamble

Microelectronics Group,

School of Electrical and Electronic Engineering, Queen's University Belfast, Ashby Building, Stranmillis Road, Belfast BT9 5AH, United Kingdom.

Tel.  : +44 (0)2890 975439

Fax. : +44 (0)2890 667023

Email : h.gamble@qub.ac.uk

 



The NISRC is a centre of excellence for research and development in silicon technology, thin film technology and novel device structures. The facility offers support through technology transfer, training and collaborative enterprise to industry in new growth areas.

 

The Centre has a complete silicon processing suite suitable for the fabrication of 0.8 mm CMOS integrated circuits on 100mm diameter substrates and limited capability on 150mm wafers. For thin film work there is a wide range of PVD systems including dc and rf magnetron sputtering and EB evaporation. The Centre is set up as a versatile research laboratory rather than a dedicated IC production facility. This enables it to respond to an increasingly wide range of industrial needs.

The Centre has been at the forefront of direct silicon wafer bonding technology for the fabrication of silicon on insulator substrates (SOI) and was able to assist a start-up company for SOI substrates to become established.

The Centre has also considerable expertise in Chemical Vapour Deposition of insulators, semiconductors and metals. This ranges from the deposition of polycrystalline silicon on glass for thin film transistor circuits to epitaxial growth of Si,Ge, for silicon HBTs.

The NISRC has recently entered the world of Nanotechnology forming part of the new £11 million Nanotech NI project in collaboration with Chemistry and Physics within QUB and the Nanotechnology Research Institute based at the University of Ulster  Jordanstown. Employing state of the art technology such as E-beam Lithography, Atomic Layer Deposition(ALD), the centre aims to fabricate nanoscale devices and Nano Electro-Mechanical Systems.(NEMS). 


 

RESEARCH AREAS

  • UHV-CVD of Si1-X Gex for thin SOI and silicon HBTs

  • Metallic ground planes and thermal vias for SOI applications

  • CVD of tungsten and copper

  • High density interconnects

  • Thin Film Transistors on glass substrates

  • mm wave components

  • Clinical sensors

  • Micro- and Nano-mechanical devices

  • Soft magnetic layers

  • Device Simulation

SPECIALIST FACILITIES

  • Atomic layer deposition system

  • ICP deep reactive ion etcher

  • E-Beam lithography system with a thermal field emission SEM

  • Direct silicon wafer bonding

  • Precision grinding and polishing of silicon

  • Anodic bonding of silicon to glass

  • UHV-CVD cluster tool with in-situ SIMS

  • Double sided mask alignment

  • Aligned wafer bonding